File
Title Transcription
ニジク オウリョク ヲ ウケル キカイ ヨウソ ヘノ ドウ メッキ オウリョク ソクテイ ホウ ノ テキヨウ
Title Alternative
Adaptation of Copper Electroplating Method to Machine Element under Biaxial Stress Condition
Authors
Keywords
Copper Electroplating Method
Biaxial Stress
Micro Circular Hole
Abstract
In the case of combined loads such as the simultaneous action of cyclic torsion and plane bending acting on the machine element, neither the first nor second principal stress amplitude can be detected by the copper electroplating method of stress analysis because this method utilizes the phenomenon that grown grains appear when the maximum shearing stress amplitude in the deposited layer attains the proper value to the plating. I comment on a unique method adopting copper foil with micro circular holes that enables separation and measurement of the first and second principal stresses in the element subjected to combined loads.
Publisher
鳥取大学大学院工学研究科研究報告編集委員会
Content Type
Departmental Bulletin Paper
Journal Title
鳥取大学大学院工学研究科/工学部研究報告
Current Journal Title
鳥取大学大学院工学研究科/工学部研究報告
Volume
38
Start Page
1
End Page
11
Published Date
2007-12
Text Version
Publisher
Rights
鳥取大学大学院工学研究科
Citation
鳥取大学大学院工学研究科/工学部研究報告. 2008, 38, 1-11
Department
Faculty of Engineering/Graduate School of Engineering
Language
Japanese