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Biometric authentication using evoked potentials stimulated by personal ultrasound 80243377 Nakanishi, Isao ナカニシ, イサオ Nakanishi, Isao Maruoka, Takehiro マルオカ, タケヒロ Maruoka, Takehiro マルオカ, タケヒロ © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collec biometrics brain wave EEG ultrasound evoked potential biometrics brain wave EEG ultrasound evoked potential In recent years, biometrics such as fingerprints and iris scans has been used in authentication. However, conventional biometrics is vulnerable to identity theft, especially in user management systems. As a new biometric without this vulnerability, we focused on brain waves. In this paper, we show that individuals can be authenticated using evoked potentials when they are subjected to ultrasound. We measured the electroencephalograms (EEGs) of 10 experimental ubjects. Individual features were extracted from the power spectra of the EEGs using the principle component analysis and verification was achieved using the support vector machine. We found that for the proposed authentication method, the equal error rate for a single electrode was about 22-32 %. For a multi-electrode, the equal error rate was 4.4 % using the majority decision rule. IEEE 2019 eng conference paper AM https://repository.lib.tottori-u.ac.jp/records/7040 10.1109/TSP.2019.8769090 Nakanishi Isao, Maruoka Takehiro. Biometric authentication using evoked potentials stimulated by personal ultrasound. Proceedings of 2019 42nd International Conference on Telecommunications and Signal Processing (TSP), pp. 365-368, Jul. 2019. Proceedings of 2019 42nd International Conference on Telecommunications and Signal Processing (TSP2019) Proceedings of 2019 42nd International Conference on Telecommunications and Signal Processing (TSP2019) 365 368 https://repository.lib.tottori-u.ac.jp/record/7040/files/TSP2019_365.pdf application/pdf 236.1 kB 2023-03-17