{"created":"2023-08-02T03:54:21.883537+00:00","id":3171,"links":{},"metadata":{"_buckets":{"deposit":"1c003225-8999-46f4-811d-52bebdc5633e"},"_deposit":{"created_by":10,"id":"3171","owners":[10],"pid":{"revision_id":0,"type":"depid","value":"3171"},"status":"published"},"_oai":{"id":"oai:repository.lib.tottori-u.ac.jp:00003171","sets":["1:10","2:14","23:39:672"]},"author_link":["1588"],"item_3_alternative_title_31":{"attribute_name":"タイトル（ヨミ）","attribute_value_mlt":[{"subitem_alternative_title":"ニジク　オウリョク　ヲ　ウケル　キカイ　ヨウソ　ヘノ　ドウ　メッキ　オウリョク　ソクテイ　ホウ　ノ　テキヨウ","subitem_alternative_title_language":"ja-Kana"}]},"item_3_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2007-12","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"11","bibliographicPageStart":"1","bibliographicVolumeNumber":"38","bibliographic_titles":[{"bibliographic_title":"鳥取大学大学院工学研究科／工学部研究報告","bibliographic_titleLang":"ja"},{"bibliographic_title":"Reports of the Graduate School/Faculty of Engineering, Tottori University","bibliographic_titleLang":"en"}]}]},"item_3_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"In the case of combined loads such as the simultaneous action of cyclic torsion and plane bending acting on the machine element, neither the first nor second principal stress amplitude can be detected by the copper electroplating method of stress analysis because this method utilizes the phenomenon that grown grains appear when the maximum shearing stress amplitude in the deposited layer attains the proper value to the plating. I comment on a unique method adopting copper foil with micro circular holes that enables separation and measurement of the first and second principal stresses in the element subjected to combined loads.","subitem_description_type":"Other"}]},"item_3_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"鳥取大学大学院工学研究科研究報告編集委員会"}]},"item_3_relation_16":{"attribute_name":"情報源","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"鳥取大学大学院工学研究科／工学部研究報告. 2008, 38, 1-11"}]}]},"item_3_rights_15":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"注があるものを除き、この著作物は日本国著作権法により保護されています。 / This work is protected under Japanese Copyright Law unless otherwise noted."}]},"item_3_source_id_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00174610","subitem_source_identifier_type":"NCID"}]},"item_3_text_32":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"鳥取大学工学部機械工学科"}]},"item_3_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"北岡　征一郎"},{"creatorName":"キタオカ　セイイチロウ","creatorNameLang":"ja-Kana"},{"creatorName":"Kitaoka, Seiichiro","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"1588","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"00023234","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://kaken.nii.ac.jp/ja/search/?qm=00023234"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2008-12-12"}],"displaytype":"detail","filename":"rgsfe038_01.pdf","filesize":[{"value":"1.0 MB"}],"format":"application/pdf","licensefree":"注があるものを除き、この著作物は日本国著作権法により保護されています。 / This work is protected under Japanese Copyright Law unless otherwise noted.","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"rgsfe038_01.pdf","url":"https://repository.lib.tottori-u.ac.jp/record/3171/files/rgsfe038_01.pdf"},"version_id":"799bd2a6-bfc3-4e04-ad56-70fa8d76a88f"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Copper Electroplating Method","subitem_subject_scheme":"Other"},{"subitem_subject":"Biaxial Stress","subitem_subject_scheme":"Other"},{"subitem_subject":"Micro Circular Hole","subitem_subject_scheme":"Other"},{"subitem_subject":"Copper Electroplating Method","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Biaxial Stress","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Micro Circular Hole","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"二軸応力を受ける機械要素への銅めっき応力測定法の適用","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"二軸応力を受ける機械要素への銅めっき応力測定法の適用","subitem_title_language":"ja"},{"subitem_title":"Adaptation of Copper Electroplating Method to Machine Element under Biaxial Stress Condition","subitem_title_language":"en"}]},"item_type_id":"3","owner":"10","path":["14","10","672"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2018-06-22"},"publish_date":"2018-06-22","publish_status":"0","recid":"3171","relation_version_is_last":true,"title":["二軸応力を受ける機械要素への銅めっき応力測定法の適用"],"weko_creator_id":"10","weko_shared_id":-1},"updated":"2023-09-27T03:21:26.540809+00:00"}