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Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material
https://repository.lib.tottori-u.ac.jp/records/7260
https://repository.lib.tottori-u.ac.jp/records/7260e9c1bbac-230f-40ec-8d5c-b50475d74f62
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
joe5_274.pdf (474.0 kB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
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| 公開日 | 2022-07-13 | |||||
| タイトル | ||||||
| タイトル | Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 資源タイプ | ||||||
| 資源タイプ | journal article | |||||
| 著者 |
李, 相錫
× 李, 相錫× Kondo, Masahiro× Komiyama, Ryohei× Miyashita, Hidetoshi |
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| 著者所属（英） | ||||||
| 言語 | en | |||||
| 値 | Graduate School of Engineering, Tottori University | |||||
| 著者所属（英） | ||||||
| 言語 | en | |||||
| 値 | Graduate School of Engineering, Tottori University | |||||
| 著者所属（英） | ||||||
| 言語 | en | |||||
| 値 | Graduate School of Engineering, Tottori University | |||||
| 著者所属（英） | ||||||
| 言語 | en | |||||
| 値 | Graduate School of Engineering, Tottori University | |||||
| 抄録 | ||||||
| 内容記述タイプ | Other | |||||
| 内容記述 | The authors proposed a novel method to maintain the alignment accuracy in the wafer-bonding process, which uses a resin as an adhesive material. Recently, the resin has received attention as an adhesive material for wafer bonding in microelectromechanical system device fabrication because of its multiple advantageous material properties. However, because of its inherent material viscosity, the alignment accuracy cannot be easily maintained, particularly when two wafers are bonded with a thick resin after alignment. To solve this problem, they proposed a local tentative bonding method. After aligning the two wafers, they irradiated the adhesive resin layer between the wafers using a near-infrared (NIR) spotlight (wavelength = 1020 nm), which is transparent to Si wafers. Using several NIR irradiation spots aimed at the resin layer after aligning the wafers, the resin layer was bonded locally and tentatively, which was sufficiently secure to avoid wafer shifting in the subsequent process. The local tentative bonded areas acted as anchors, which held the wafers during the bonding process. They performed experiments to demonstrate the effectiveness of their method using resins, such as polyimide, benzocyclobutene and SU-8. Consequently, they achieved an alignment accuracy <5 µm, which is a significant improvement compared with the typical bonding results. | |||||
| 書誌情報 |
JOURNAL OF ENGINEERING-JOE en : JOURNAL OF ENGINEERING-JOE 巻 2018, 号 5, p. 274-278, 発行日 2018-05 |
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| 出版者 | ||||||
| 出版者 | Institution of Engineering and Technology | |||||
| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 20513305 | |||||
| DOI | ||||||
| 関連タイプ | isIdenticalTo | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.1049/joe.2017.0801 | |||||
| 権利 | ||||||
| 権利情報 | (C) 2021 The Institution of Engineering and Technology. This is an open access article published by the IET under the Creative Commons Attribution-NonCommercial-NoDerivs License (http://creativecommons.org/licenses/by-nc-nd/3.0/) | |||||
| 情報源 | ||||||
| 関連名称 | Kondo Masahiro, Komiyama Ryohei, Miyashita Hidetoshi, et al. Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material. JOURNAL OF ENGINEERING-JOE. 2018. (5). 274-278. doi:10.1049/joe.2017.0801 | |||||
| 関連サイト | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | https://ietresearch.onlinelibrary.wiley.com/doi/full/10.1049/joe.2017.0801 | |||||
| 関連名称 | https://ietresearch.onlinelibrary.wiley.com/doi/full/10.1049/joe.2017.0801 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
