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  1. 学部学科区分一覧
  2. 工学部・工学研究科
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  2. 学術雑誌論文

Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material

https://repository.lib.tottori-u.ac.jp/records/7260
https://repository.lib.tottori-u.ac.jp/records/7260
e9c1bbac-230f-40ec-8d5c-b50475d74f62
名前 / ファイル ライセンス アクション
joe5_274.pdf joe5_274.pdf (474.0 kB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2022-07-13
タイトル
言語 en
タイトル Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material
言語
言語 eng
資源タイプ
資源タイプ journal article
著者 李, 相錫

× 李, 相錫

WEKO 4919
e-Rad 50625233
研究者総覧鳥取大学 100000585

李, 相錫

ja-Kana リ, サンソク

en Lee, Sang-Seok

Search repository
Kondo, Masahiro

× Kondo, Masahiro

WEKO 26939

en Kondo, Masahiro

Search repository
Komiyama, Ryohei

× Komiyama, Ryohei

WEKO 26940

en Komiyama, Ryohei

Search repository
Miyashita, Hidetoshi

× Miyashita, Hidetoshi

WEKO 26941

en Miyashita, Hidetoshi

Search repository
著者所属(英)
en
Graduate School of Engineering, Tottori University
著者所属(英)
en
Graduate School of Engineering, Tottori University
著者所属(英)
en
Graduate School of Engineering, Tottori University
著者所属(英)
en
Graduate School of Engineering, Tottori University
抄録
内容記述タイプ Other
内容記述 The authors proposed a novel method to maintain the alignment accuracy in the wafer-bonding process, which uses a resin as an adhesive material. Recently, the resin has received attention as an adhesive material for wafer bonding in microelectromechanical system device fabrication because of its multiple advantageous material properties. However, because of its inherent material viscosity, the alignment accuracy cannot be easily maintained, particularly when two wafers are bonded with a thick resin after alignment. To solve this problem, they proposed a local tentative bonding method. After aligning the two wafers, they irradiated the adhesive resin layer between the wafers using a near-infrared (NIR) spotlight (wavelength = 1020 nm), which is transparent to Si wafers. Using several NIR irradiation spots aimed at the resin layer after aligning the wafers, the resin layer was bonded locally and tentatively, which was sufficiently secure to avoid wafer shifting in the subsequent process. The local tentative bonded areas acted as anchors, which held the wafers during the bonding process. They performed experiments to demonstrate the effectiveness of their method using resins, such as polyimide, benzocyclobutene and SU-8. Consequently, they achieved an alignment accuracy <5 µm, which is a significant improvement compared with the typical bonding results.
書誌情報 JOURNAL OF ENGINEERING-JOE
en : JOURNAL OF ENGINEERING-JOE

巻 2018, 号 5, p. 274-278, 発行日 2018-05
出版者
出版者 Institution of Engineering and Technology
ISSN
収録物識別子タイプ ISSN
収録物識別子 20513305
DOI
関連タイプ isIdenticalTo
識別子タイプ DOI
関連識別子 10.1049/joe.2017.0801
権利
権利情報 (C) 2021 The Institution of Engineering and Technology. This is an open access article published by the IET under the Creative Commons Attribution-NonCommercial-NoDerivs License (http://creativecommons.org/licenses/by-nc-nd/3.0/)
情報源
関連名称 Kondo Masahiro, Komiyama Ryohei, Miyashita Hidetoshi, et al. Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material. JOURNAL OF ENGINEERING-JOE. 2018. (5). 274-278. doi:10.1049/joe.2017.0801
関連サイト
識別子タイプ URI
関連識別子 https://ietresearch.onlinelibrary.wiley.com/doi/full/10.1049/joe.2017.0801
関連名称 https://ietresearch.onlinelibrary.wiley.com/doi/full/10.1049/joe.2017.0801
著者版フラグ
出版タイプ VoR
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